随附 AWG 26-24 触点和插入 / 拔取工具
Lightweight design and very high density, microComp® is an alternative to HD DSUB with superior characteristics,A flexible alternative to MIL-STD 83513 connectors.
Dismountable contacts for wiring flexibility
Lightweight composite materials
High vibration withstanding
| 属性 | 数值 |
|---|---|
| 触点数目 | 25 |
| 性别 | 母座 |
| 主体定位 | 直向 |
| 安装类型 | 电缆安装 |
| 节距 | 2.0mm |
| 端接方法 | 压接 |
| 额定电流 | 2.5A |
| 外壳材料 | 玻璃纤维增强复合材料 |
| 长度 | 37.72mm |
| 宽度 | 11.11mm |
| 深度 | 7.82mm |
| 系列 | MicroComp |
| 触点电镀 | 金 |
| 触点材料 | 铜合金 |
| 尺寸 | 37.72 x 11.11 x 7.82mm |
